Baking is one of the most hated things a PCB assembler must do... other than maybe sending that check to the IRS. It's time consuming, expensive and is a no-added-value process. It promotes intermetallic growth and degrades solderability. Anything you can do to reduce it is an improvement.

The IDC Thermal-Wall™ process removes sufficient moisture from “wet” MSD packages in just 24-hours to prevent package delamination at lead-free solder temperatures.

Devices can remain in tape and reel or plastic shipping tubes, during the vacuum-assisted process, saving you time and money.

Here is the “Offer You Can’t Refuse!”

Many don't have the time to assess, and therefore don’t realize, the impressive savings in both dollars and time that can be gained by changing to this modern drying process - payback periods of five to ten months are not unusual.

Realizing this IDC, automated this study in Excel©. All that you have to do is answer two-pages of straight-forward questions about your present MSD drying process and email it to us. We will put it into our model and will return the completed study to you within two-weeks. Your data will be held in the strictest confidence.

Our analysis includes:

Click Here to download your free “An Offer That You Can’t Refuse” questionnaire. We doubt you will be disappointed with the results! (user registration required)