The Thermal-Wall™ drying process recovers 50% or more of a package’s expired floor-life of taped and reeled moisture-sensitive components. This prevents internal delamination at no-lead solder reflow temperatures.

The 70˚C process results in only cosmetic changes to cover and carrier tapes. Tape peel force remained within EIA 481 specifications. With special tooling, high impact polystyrene reels experienced no functional deformation.

The chamber is reduced to ≈100 Torr. Contrary to some claims, vacuum has no affect on the rate of moisture removal from a package. Vacuum is only the cheapest means of lowering the chamber’s relative humidity to near zero. Additionally, The “I-Dry™” oven's cylindrical shape assures uniform chamber temperature.

To learn more about the details of IDC's cutting edge drying process, visit our "Presentations/Media" section.