The Innovative Drying Company maintains a variety of informative presentations, and media, in our secure archive.

Look here for a library of presentations, white papers and more - for those involved with the task of drying MSD surface-mount packages.

To access this information, you will need to register with the IDC website, once confirmed, we will provide your login details.

We are updating our 'Presentation/Media Archive' constantly. Check back for useful information regularly. Following are a few highlights from the IDC Archive.

"IDC Presenttion to the IPC/JEDEC Subcommittee" IDC was asked to present its novel 24 hour baking process for consideration for inclusion in the next revision of J-Std-033.

This is the presentation that we gave to IPC/JEDEC Subcommittee JC14.1 at the 2009 APEX Expo in Las Vegas, Nevada.

"Glass Half Full – Presentation" - IDC's Cheif Engineer, Charles Leech presents the holes in the typical J-STD-033B baking schedule and reveals how to overcome the shortcomings of this standard by applying IDC's "innovative" drying process. (PowerPoint required)

"Drying Moisture-Sensitive Packages – Tutorial"- A look into IDC's innovative Thermal-Wall™drying process, as presented to SMTA – Arizona/Sonora Chapter

IDC Proof of Process Experimental Findings – This paper reports the findings of a two-year long independent study into low-temperature, vacuum-assisted moisture removal from moisture-sensitive packages in tape and reel.

Lectures and Interviews:

IDC Director of Engineering, Charles "Stu" Leech interviews with Joeseph Falstad on "Real Time - with IPC"- JEDEC moisture sensitivity levels have been pushed out of lead-free processing--shortening the length of time that components can be exposed before use. Stu Leech describes IDC's method for extending the floor life of components in carriers and reels.

IDC Director of Engineering, Charles Leech interviews with Dan Beaulieu on "Real Time - with IPC"- Here Charles discusses our process where half the moisture from a package can be removed in only 24 hours—giving back half the package’s floor life.

Industry Specifications:

IPC/JEDEC J-Std-033B.1 – Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices.

IPC/JEDEC J-STD-033B.1 includes amendment 1 (1/2007) supersedes IPC/JEDEC J-STD-033B (10/ 2005)

IPC/JECEC J-Std-020D.1 – Moisture/Reflow Sensitivity Classification of Non-Hermetic Solid State Surface Mount Devices.

IIPC/JEDEC J-STD-020D.1 (3/2008) Supersedes IPC/JEDEC J-STD-020D (8/2007)

IPC/JEDEC J-Std-035 – Acoustical Microscopy for Nonhermetic Encapsulated Electronic Components

IPC/JEDEC J-Std-075 – JOINT INDUSTRY STANDARD Classification of Non-IC Electronic Components for Assembly Processes

ECA/IPC/JEDEC J-STD-075 (8/2008)

EIA -481C - 8 mm Thru 200 mm Embossed Carrier Taping of Surface Mount Components for Automatic Handling